Welcome to the official website for the 2024 IEEE 42nd International Conference on Electronics and Nanotechnology (ELNANO), which will be held in frames of IEEE Kyiv Polytechnic Week at Igor Sikorsky Kyiv Polytechnic Institute on May 13 – 16, 2024 in Kyiv, Ukraine. The well-known professionals, as well as post-graduate students from Armenia, Belarus, Brazil, Czech Republic, Estonia, Germany, India, Iran, Italy, Jordan, Korea, Latvia, Mexico, Norway, Pakistan, Poland, Portugal, Slovakia, Spain, Switzerland, Ukraine, United Kingdom, United States and other countries, traditionally participate in the conference. Starting from 2013, ELNANO is co-organized by the Institute of Electrical and Electronic Engineers (IEEE). Conference Proceedings of IEEE ELNANO 2013-2022 are included in the IEEE Xplore Digital Library as well as indexed in Abstracting and Indexing databases (Scopus, Web of Science, Google Scholar, etc). The working language of the conference is English.
IEEE ELNANO-2024 is delivered in a hybrid format taking into account the war in Ukraine against the invaders from the neighboring terrorist country.
The general topics of the Conference
SECTION 1. MICRO- AND NANOELECTRONICS
Nanostructures and nanotechnology in electronics;
Components of micro- and nanoelectronics;
Micro- and nanosystems in electronics;
Micro- and nanophotonics;
Nanomaterials and structures;
Micro- and nanosensors;
Application of micro- and nanostructures,
devices and microsystems in electronics.
SECTION 2. BIOMEDICAL ENGINEERING
Biomedical signal processing and analysis; Biosignals monitoring; Biomedical image processing and analysis; Bioinformatics and computational biology; Computer-aided diagnosis; Biosensors; Bioelectronic systems for monitoring, diagnostics and treatment; Wearable bioelectronic systems; Machine learning in biomedical applications; Bionanotechnology; Mathematical modeling in biomedical engineering; Lab-on-a-chip devices; Organ-on-a-chip technology; Electromagnetic compatibility
SECTION 3. ELECTRON DEVICES AND SIGNAL PROCESSING
Materials for electron devices and their interconnects; Electron device engineering; Modeling/simulation of electron devices and processes; Photo-electronic, electro-magnetic, electromechanical, electro-thermal, and bio-electronic signals in electron devices; Reliability of electron devices; Signal processing and recognition; Artificial intelligence in signal and image recognition; Machine learning for signal processing
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